Description

Bismuth-tin alloy (Bi58Sn42) is a low-temperature eutectic alloy with a melting point of 138℃. It possesses good strength and fatigue resistance but has poor ductility. This green and environmentally friendly alloy exhibits excellent wetting properties. When used as a solder, it is sensitive to lead (Pb); contact with Pb during soldering forms a eutectic alloy that exacerbates solder joint detachment upon solidification. Bismuth-tin eutectic alloys are commonly used in low-temperature soldering processes and assembly of lead-free electronic products.

Basic Information

Product Name	Bismuth Tin Powder
Purity	99.99% 99.999%
Ratio	Bi58Sn42 or custom ratio
Particle Size	100, 200 325 500 1000mesh
Color	Grey Powder
Melting point	138 ℃ or custom melting point
Density	8.65 g/cm3
Conductivity	0.383uΩ..mat 20 °C
Tensile strength	55.16 MPa
Thermal conductivity	≥19w/m.k

Applications

Bismuth Tin alloy have low melting points, as well as low strength and hardness. They exhibit high thermal conductivity and a low coefficient of thermal expansion, resist atmospheric corrosion, provide excellent lubrication properties, and are easy to bond with materials such as steel, copper, aluminum, and their alloys, making them excellent soldering materials and promising bearing materials. They are also considered a promising type of low-melting alloy widely applied in electrical, steam, and fire alarm equipment as soldering materials and fuses.

Product Storage

This product should be stored in a cool, dry, well-ventilated area, away from combustibles, acids, alkalis, and strong oxidizing materials. After storage for more than 3 months, it should be re-examined to confirm that its quality has not changed before use.

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