Bismuth Target

Description

We specializes in producing high purity Bismuth Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.

All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). “Sputtering” allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation.

Basic Information

Advantages

• The heavy metal content is far lower than guaranteed value, and actual purity is higher than standard one.
• The oxygen content is extremely low, and the surface is smooth.
• According to the low range of raw material cost, our quotation is calculated to save customer costs.
• Vacuum processing and packaging to prevent oxidation.
• Technical support within 60 minutes by e-mail, calling or instant message.
• ISO9001 and ISO14001 certificated manufacturer.
• Strict raw material quality control and test report, customers do not have to worry about quality problems.
• Door-to-door shipping with fast delivery.
• Deeply cultivated in the rare metal industry for more than 15 years, accumulated rich experience, and formed a stable supply chain.